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Material: VC soaking plate is the abbreviation of VaporChamber, also known as vacuum chamber soaking plate heat dissipation technology. In the early stages of mobile phone cooling, graphite was usually used as the main material and can be referred to as the first generation of cooling.

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Material: VC soaking plate is the abbreviation of VaporChamber, also known as vacuum chamber soaking plate heat dissipation technology. In the early stages of mobile phone cooling, graphite was usually used as the main material and can be referred to as the first generation of cooling.

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Material: VC soaking plate is the abbreviation of VaporChamber, also known as vacuum chamber soaking plate heat dissipation technology. In the early stages of mobile phone cooling, graphite was usually used as the main material and can be referred to as the first generation of cooling.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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Firstly, the heat dissipation efficiency of the slotted heat sink is very high, which can effectively reduce the temperature of electronic devices and ensure their normal operation. This is because the slotted heat sink adopts a special design that can increase the heat dissipation area, thereby improving the heat dissipation efficiency.

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;