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1. Material: Silicon carbide; 2. Thermal conductivity: average around 6.79w/m.k; 3. Density: 1.89, coefficient of thermal expansion: 0.000004;

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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In order to improve the heat dissipation performance of electronic component finned heat sinks, a plug-in heat pipe finned heat sink was developed and experimental research was conducted in natural and forced convection environments.

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The profile type radiator has the characteristics of good heat dissipation performance and energy-saving effect, and is currently one of the widely used radiator types in the market.

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The profile type radiator has the characteristics of good heat dissipation performance and energy-saving effect, and is currently one of the widely used radiator types in the market.