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Electric vehicle controller heat dissipation

Wind power converters dissipate heat

Photovoltaic inverter heat dissipation

Laser welding and cutting heat dissipation

Energy storage system heat dissipation

The power battery pack dissipates heat

Motor housing heat dissipation

Embedded computer heat dissipation

Converter heat dissipation

Power quality SVG heat dissipation

IT communication heat dissipation

Medical ultrasonic heat dissipation

POWER QUALITY SVG HEAT DISSIPATION

The static reactive power compensation device (SVC) is a kind of important equipment for comprehensively controlling voltage fluctuation, flicker, harmonic and voltage imbalance. SVG is a new static reactive power compensation device which is more advanced than SVC. It is an important part of FACTS technology and custom power (CP) technology. It is the development direction of modern reactive power compensation device. They are widely used in power transmission and distribution systems: long-distance power transmission, urban secondary substation (35/110kv), arc furnace, mill hoist and other heavy industry loads, regional power grid, pv power supply, wind farm, electric locomotive power supply and other fields. SVG is a high-heat element, which needs to be combined with a radiator with excellent heat dissipation performance to ensure the stable operation of other elements and increase the working time.

SVG Case Study of Air-cooled Heat Dissipation Solution

Customer SVG heat dissipation design requirements are as follows

Ambient temperature：	40℃	Style and type：	R4D560-AQ03-01
Altitude：	3000m	Overall temperature requirements：	<35℃
Assume IGBT model：	Infineon IHV IGBT，1250W/pcs，Common2pcs, Resistor body100W， total 2600W.	Heat Dissipating Medium Model：	I0.2mm K=4W/m*K
Module Power and Number：	7，Total power is2600*7=18200W

IGBT Model simulation schematic diagram and parameters

· The radiator size is 400x380x100mm，Specific Design of Heat Pipe Distribution；

· Use thermal conductive silicone grease between heater and radiator；

· Using wall thickness 1.0MM Customized heat pipe to ensure heat dissipation efficiency；

· 8 branches at the bottom 9.5 mm Heat pipes are grooved and flattened to ensure heat dissipation efficiency；

· Thermal analysis Epoxy thermal conductivity is adjusted to the corresponding data of working limit temperature to ensure the consistency between simulation and practice.；

· All-aluminium radiator Bonded；

· The single weight of the product is about 10%.：22.6Kg；

· Bottom plate FIN Use of tablets AL5052 Thermal conductivity：138 w／m^2 K；

The parameters of radiator fan are as follows

Ebm-papst 560 Fan type，Type is：R4D560-AQ03

Plane schematic diagram of radiator form

Use bonded fin +8 Heat pipe design

Simulation sketch of radiator inlet and outlet air

Drawing of Wind Flow Simulation

Temperature simulation sketch of radiator

IGBT Permutation map Population wind speed is the middle point of fin shape outer distance of radiator 2~3 cm

Simulating schematic diagram of temperature measuring point of radiator

Item	Maximum temperature℃	Inlet wind speed m/s	Thermal Resistance C/W	Radiator simulation data show that the temperature is all in 75℃ Below, the temperature rise is less than 35 degrees Celsius, which meets the requirements set by customers.
Module1	74.56	5.4	0.0133
Module2		5.39	0.013
Module3	74.52	5.4	0.013
Module4	74.72	5.36	0.013
Module5	74.56	5.56	0.013
Module6	74.63	5.58	0.013
Module7	74.43	5.58	0.013