APPLICATION INDUSTRY

APPLI

INDUSTRY

IT COMMUNICATION HEAT DISSIPATION

 

3C product also calls information home appliance, it is to show computer kind communication kind and consumer kind electronic product commonly. Various kinds of market demand are large. China has become the largest consumer market in the world for 3C products. With the improvement of national economic level and income level, Chinese has put forward higher requirements for the quality of electronic products. Businesses have launched products with higher configuration, higher performance and better design to satisfy consumers.

 

 

Customer SVG heat dissipation design requirements are as follows 

    
PCB source Temperature ≤100℃
CPU Temperature ≤100℃


 

DC Output Conductivity:10W/(m*K) Power:5W
CPU Chipset Conductivity:10W/(m*k) Power:10W
PCB MST Conductivity:15W/(m*K) Power:5W
CPU PCB Conductivity:15W/(m*K) Power:4W
CPU Heatsink Size：125*95*6mm，Substrate thickness:2mm，fin Number: 10pcs， Thickness：0.6mm；Conductivity: AL-extru. 180W/(m*K).
CU Block Size：41*41*4.7，Conductivity:385 W/(m*k)
Thermal paste Thickness： 0.3mm，Conductivity:3.5W/(m*K)
Welding mode Soldering4258，Conductivity:48W/(m*k) 0.2mm
 
Schematic diagram of simulation model for overall layout of heat dissipation 

 
Schematic diagram of simulation model for overall layout of heat dissipation
Copper fin Size:30*12*0.3mm，Tilt：1.0，Number：30pcs.
Material Science:C1100，Conductivity:385W/(m*K).
Heat pipe D6 Tube thickness：3mm，Pressing process, heat pipe type: powder sintering，Conductivity:10000W/(m*k).
Adding a 30*10 mm axial flow fan, the opening ratio of the new fan opening area 0.7.
A partition Size:160*33*0.5mm，Material Science: Stainless steel.

 

 
RX Temperature Distribution Diagram of Module Top Simulation  

 

 
RX Temperature Distribution Diagram of Module Top Simulation

 
Schematic diagram of simulation model for overall layout of heat dissipation
NO. Maximum temperature NO. Maximum temperature NO. Maximum temperature
Source 1 59.43 Source 1.7 59.73 Source 3.1 59.59
Source 1.1 59.54 Source 2 60.02 Source 3.2 59.7
Source 1.2 59.66 Source 2.1 60.19 Source 3.3 59.77
Source 1.3 59.73 Source 2.2 60.16 Source 3.4 59.8
Source 1.4 59.76 Source 2.3 59.96 Source 3.5 59.8
Source 1.5 59.77 Source 2.4 59.96 Source 3.6 59.78
Source 1.6 59.76 Source 3 59.48 Source 3.7 59.74

 

 

  CPU Maximum temperature（℃） Temperature range of heat source（℃） System airflow(ft^3/min)
Simulation results of the scheme 64.43 60.92~59.43 8.4
It meets the requirements of CPU temperature less than 80 C and heat source body temperature less than 100 C, and completes the heat dissipation design requirements.

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